It seems to me that you have an issue with an installation failing due to not effectively bonding it to the common electrode. I have seen numerous installations in the field failing to meet this NEC requirement. Keep in mind that the odds of something catastrophic happening as a result of the bonding issue are very small but the potential consequences are much greater than simply failing an installation QC. I'd recommend adhering to sound engineering procedures and Bond all installations instead of trying to circumvent the practice.
Good luck finding your sheet.
Re: Dish Network Point System
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